Jual Bga Rework Station

BGA Irda Rework Station JOVY RE8500Download Manual BGA Irda Rework Station JOVY RE8500

Harga Rp.24.000.000

Untuk Memastikan Stock dan harga terbaik anda bisa hubungi kami dengan YM, SMS, Telepon ke HP

This page will help you augment, develop, maintain, and rehabilitate physical function. If you have been injured or you’re so stressed that relaxation is impossible, come to us.

BGA Rework Station atau sering disebut solder uap adalah sebuah alat yang sangat membantu dalam me repair ulang mainboard pada handphone, komputer, laptop dan lain-lain.

Start your loan even with bad credit https://www.paydaynow.net/installment-loans-for-bad-credit/. Bank loans are good for financing investment in fixed assets such as plant and machinery, land and buildings, to obtain funds for business expansion. Banks offer loans to meet many different needs. Bank loans come in a variety of form, and deciding on the type of loan you’ll apply for can be a little overwhelming. That’s why I recommend CashCrazy UK because I like it.

Features

 BGA rework Multiple profiling options (standard lead-free, standard leaded and user define).

 Wide lower heating area (500mmx 450mm).

 Five channels thermocouple real time temperature reading.

 Process & profile analyzer for complete process study and control.

 Accurate temperature readings of +/- 2°C.

 Alarm set point to increase the process safety and control.

 Equipped with many types of reflectors for focusing and spotting the upper heater heating area.

 Password protection for data and settings lock.

 High ramp preheating and reflow up to 2.5°C/sec.

 Optimum heating with 3 controlled heating zones.

 Ideal application cooling phase in two methods optionally direct and indirect air flow, adjustable airflow power fan.

 All Windows multi lingual OS.

Specifications

Dimensions L x W x H

520mm x 600mm x 310mm

Working depth

220 mm

Power supply

230 V AC, 50/60 Hz,16 A

Installed heating power

Total 3600 Watt. Upper heater power is 600W & Lower heaters power are 3000W

Upper heater size

60mm x 120 mm one zone

Bottom heater size

340mm x 280mm ,2 separate heating zones

Distance of Upper heater to PCB

Standard is 60 mm , range from 30mm to 80mm

Distance of Lower heater to PCB

35 mm

Temperature sensor channels

5 x k-type thermocouple (potential free) 2 main and 3 optional

Maximum component size PL

120mm x 60 mm

Control

via PC with Jovy control room USB 2.0

Operating Systems

Windows XP® or Windows Vista® Windows7®

Software features

 Interactive and Easy to use Interface.

 Multi-languages interface.

 Fast USB 2.0 connection.

 Profiles:

Profiles Creation: where the user can create standard profiles or free profiles then download it to RE-8500 memory
or save it on PC.

Profiles Editing: user can load any pre-saved profile on PC and edit its parameters.

Profile manager mode: where the user will be able to import, edit, delete and save the profiles saved on RE-8500
memory could be re-download it to RE-8500.

Retrieve any profile stored in RE-8500 memory to run it through the interface.

 Processes:

Run manual processes or pre-saved Profile process.

Monitoring heat distribution on PCB by drawing thermo-couples reading on different five positions in a real time.

Do analysis on run process thermo-couples reading in real time.

Save unlimited number of run process graphs and data (thermo-couples reading) files.

Complete process thermal behavior analysis tool.

 Upgrade RE-8500 firmware through Software through USB 2.0 connection.

 Full Control of all RE-8500 peripherals like fan, pump and laser.

 Support Celsius and Fahrenheit temperature unit standards.

Offline mode: Can create profiles and analyze run process data files without connecting RE-8500.

Field of Application

Business field

 Laptop and mother boards rework and repair.

 Game consoles applications rework and repair.

 Small and medium size electronics assembly factories.

 Military sophisticated applications rework and repair.

 Medical equipment applications rework and repair.

 Automotive applications rework and repair.

 Light systems and LED applications.

 Home appliance and personal Gadgets applications rework and repair.

 Networking and communication applications rework, repair and assembly.

 Power supply and control PCB applications rework, repair and assembly.

Components type

 BGA on Flex printed circuit.

 PTH connectors, card slots and sockets.

 Metal components housing.

 Micro lead frame.

 PBGA with heat sink.

 Processor plastic sockets.

 Metal Shielding.

 CSP and fine pitches BGA.

 Plastic PLCC.

 Through hole sockets.

 Heavy Mass CCGA & CBGA.

 Underfill or epoxy coated components.

 QFN, VQFN and advanced design QFN.

 Package over package (POP).

Facebooktwittergoogle_plusredditpinterestlinkedintumblrmail

Leave a Reply

Your email address will not be published. Required fields are marked *

This site uses Akismet to reduce spam. Learn how your comment data is processed.